VORAGO leads the industry in providing radiation hardened and radiation tolerant microcontrollers and microprocessors for Aerospace, Defense and Industrial projects around the globe. VORAGO’s patented HARDSIL® technology uses cost-effective, high-volume manufacturing to harden any commercially designed semiconductor component. WHO WE ARE
COMPANY HISTORY
2024
VORAGO announces the VA7230 edge computing microprocessor, the first Arm®-based microprocessor (MPU) with an embedded graphics processor (GPU) targeted at space applications.
VORAGO partners with AMD to enable in-flight reconfiguration of AMD Space-Grade FPGAs with rad-hard MCUs.
The Defense Logistics Agency grants certification to VORAGO for QML class level Q & V Radiation Hardness.
For the third time, VORAGO is named to the Inc. 5000 List of America's Fastest-Growing Private Companies. VORAGO ranked No. 9 in the Engineering industry nationwide, and No. 1275 across all industries.
VORAGO Technologies Joins Forces with CA DREAMS Hub to Advance 5G/6G mmW Technology for Defense and Space Applications
For the second year in a row VORAGO honored on the Deloitte Technology Fast 500™ List boasting 408% revenue.
2023
VORAGO honored for the first time on the Deloitte Technology Fast 500™ List, among a small group of only 4% of the list coming from the Hardware & Semiconductor category.
For the second time, VORAGO is named to the Inc. 5000 List of America's Fastest-Growing Private Companies. VORAGO ranked No. 20 in the Engineering industry nationwide, and No. 1901 across all industries.
Mandy Vaughn, Founder and CEO of GXO, Inc., joins the VORAGO Board of Directors.
SkyWater Technology announced a strategic partnership with VORAGO Technologies, effectively moving VORAGO’s fabrication efforts stateside to SkyWater’s DMEA-accredited Category 1A Trusted Foundry.
2021
VORAGO adds to its M4 portfolio with the introduction of two new radiation-hardened microcontrollers, the Arm Cortex-M4 VA41628 and VA41629.
VORAGO completes the highest level of spaceflight qualifications of MIL-PRF-38534. VORAGO’s entire Arm® Cortex-M4 family of integrated System-on-Chip (SoC) products, is qualified for full spaceflight, making it the only company to achieve full spaceflight qualification on the Arm® Cortex-M4 family of products.
VORAGO announces 4-channel rad-hard latch-up monitor IC (LUMIC) solution, the VC91200.
In an innovative move to combat semiconductor lead times, component availability issues, and the use of unreliable automotive and COTS parts in space, VORAGO introduces a readily available rad-tolerant Arm® Cortex-M0, the VA10805, with TID protection up to 300 krad(Si) for the emerging space market.
2020
VORAGO Technologies Debuts on the 2020 Inc. 5000 With Three-Year Revenue Growth of 87 Percent. VORAGO ranked No. 57 in the Engineering industry nationwide, and No. 4009 across all industries.
VORAGO announces family expansion with VA416XX and VA108X0 radiation-hardened Arm® Cortex® MCUs into BGA packages for Defense and Aerospace. With these offerings, VORAGO now provides the smallest packaged IC in its class and offers unprecedented choice in a marketplace dominated by limited, less-flexible legacy components.
VORAGO Technologies announces the issuance of Patent titled METHOD FOR FORMING FINFET DEVICE STRUCTURE. This latest patent, US Patent Number 10,615,260 titled METHOD FOR FORMING FINFET DEVICE STRUCTURE, is a complement to a previous patent issued to VORAGO Technologies, US Patent Number 10,038,058. US Patent 10,615,260 is part of the extension of VORAGO's HARDSIL® technology to non-planar CMOS technologies. It describes methods of efficiently fabricating HARDSIL®-protected FinFET devices using conventional semiconductor fabrication equipment and steps. HARDSIL® structures formed using the described methods protect the FinFET devices from SEE, Latch-up and TID in radiant and high-temperature environments by directing charge generated by external stimuli away from active device regions.
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VORAGO delivers system-in-package prototype samples and evaluation kits to NASA as part of an ongoing NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA). The SIP implementation is five times smaller than an equivalent circuit that utilizes conventional discrete ICs.
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Phase 2 of RHEME study begins, with another nine rad-hard CMOS die from VORAGO. Phase 2 is an attempt to study the frequency and effect of high-energy particle strikes on CMOS memory devices in space, repeating the experiment from Phase 1 in sun-synchronous orbit.
Bright Ascension Develops Software in Support of VORAGO's RH-OBC-1 Plug-and-Play Components for Smallsats
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RHEME (the Radiation Hardened Electronic Memory Experiment) begins to monitor the effect of particle strikes on memory, with the experiment monitored and controlled by a VORAGO MCU based on the Cortex-M0 core. Nine rad-hard CMOS die from VORAGO were sent to the International Space Station for the experiment. This project – supported by Air Force Research Laboratory and NASA – marks the first time an ARM-based radiation-hardened microcontroller, designed specifically to withstand extreme conditions, has been deployed in space.
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VORAGO launches its VA108x0 MCUs – the first ARM Cortex based microcontrollers designed specifically for radiation and extreme temperature operation without up-screening.
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Bernd Lienhard announced as new CEO; leads product line expansion strategy and re-branding effort.
The company name is changed from Silicon Space Technology Corp. to VORAGO Technologies Inc.
VORAGO announces the addition of extreme temperature-hardened solutions to its technology in tandem with the name change.
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The company partners with Texas Instruments to introduce its first product, a QML-V space-qualified radiation-hardened 16Mb SRAM. This product stands out as the only radiation-hardened SRAM offering that combines superior radiation hardening without sacrificing performance.
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VORAGO Technologies founded under the original name Silicon Space Technology Corp.