Achieve Your Mission

Built for Extremes.

Designed to Scale.

VA42620 chip
A Vorago V41630 MCU built on Arm Cortex-M4 cores with ceramic packaging.

VORAGO leads the industry in radiation- and temperature-protected microcontrollers and microprocessors. Patented HARDSIL® technology fortifies commercial semiconductor designs for the world’s harshest environments. VORAGO offers 100% drop-in compatible, radiation-hardened and radiation-tolerant MCUs, giving customers a single design across multiple radiation price and performance envelopes.

VORAGO Climbs 2026 Inc. 5000 List, Marking 5th Appearance on Prestigious Entrepreneurial U.S. Ranking. LEARN MORE

Find the Right Solution for What Comes Next

From Low Earth Orbit to Deep Space

The VA4 microcontroller family gives engineers a common Arm® Cortex®-M4 core foundation across radiation-tolerant and radiation-hardened components. Choose integrated or external non-volatile memory, the peripheral mix, package, and radiation performance that fit the mission, from cost-conscious low Earth orbit platforms to high-reliability geosynchronous orbit and deep-space systems.

Built for Extreme Environments Where Standard Chips Fail

VORAGO microcontrollers and microprocessors deliver specialized, high reliability compute and control across space, orbital, atmospheric, and terrestrial environments.

Radiation Protection Built Into the Silicon

VORAGO specializes in Radiation Hardened by Process (RHBP) technology, hardening commercial semiconductor designs against radiation and extreme temperature effects during manufacturing. Its patented HARDSIL® technology is VORAGO’s proprietary RHBP approach, building radiation resilience directly into the device to protect mission-critical electronics from latch-up and other radiation-induced failures in extreme environments. HARDSIL® is the foundation of VORAGO’s radiation-hardened portfolio and is also licensed to other semiconductor companies. VORAGO has also created a new Radiation Tolerant by Design (RTBD) category, the technique used to produce the complementary radiation-tolerant twin MCU.

Achieve Your Mission with VORAGO’s Arm® Cortex®-based rad-hard, rad-tolerant, and extreme temperature solutions

Flagship Microprocessors & Microcontrollers

  • Dual 1.5 GHz Arm® Cortex®-A72 Cores

  • 1st edge computing MPU with integrated 3D GPU

  • PCIe, USB 3.0, and SATA

  • 6 total Ethernet Interfaces up to 2.5Gbps

  • 4-port TSN switch

  • Arm® TrustZone® and Secure Boot

  • 8 Rad-Hard and Rad-Tolerant options

  • SMD (Standard Microcircuit Drawing) component qualified to QML-Q (Military High-Reliability) with a Radiation Hardness Assurance (RHA) level of 100 kRad(Si)

  • 256kB program, 64kB data memory, 256kB NVM

  • 8-Ch. ADC, 2-Ch. DAC, Ethernet, SpaceWire

  • Dual-core Arm® Cortex®-M55 Microcontroller

  • Rad-Hard and Rad-Tolerant options

  • 256kB NVM

  • 512kB on-chip double word SRAM

  • 128kB on-chip byte SRAM

  • EDAC & scrub engine for error resilience

VORAGO is the first and only to lead in Radiation Hardened by Process (RHBP) commercial chips ensuring they withstand the deep vacuum of space and radiation strike in Earth's orbit and commercial airflight.

HARDSIL®: Engineering Excellence for Mission Success

With our unwavering focus on semiconductor components and high-reliability electronics, VORAGO's HARDSIL® process technology empowers mission success. We have meticulously crafted radiation-hardened semiconductor components that excel in extreme environments, withstanding radiation, single-event effects, and more. Our dedication to excellence helps ensure that your space and orbit applications are equipped with consistently high-reliability chips across multiple price points.

VORAGO Climbs 2026 Inc. 5000 List, Marking 5th Appearance on Prestigious Entrepreneurial U.S. Ranking

VORAGO Technologies Named to the Inc. 5000 List of America’s Fastest-Growing Private Companies for 2025.

For the 3rd consecutive year, VORAGO Technologies Honored on Deloitte’s Technology Fast 500 2025 List.

SATELLITE

Rad-hardened and rad-tolerant chips built to scale seamlessly across orbits—from high-volume LEO to the Van Allen Belts in MEO.

DEEP SPACE

Radiation-protected compute for deep-space exploration, scientific instruments, and long-duration missions.

AUTONOMOUS DEFENSE

High-reliability components for mission-critical control, communications, and autonomous systems.

Upward view of a rocket launch pad, and the starlit sky.

ENERGY

Extreme-temperature and radiation-resilient components for demanding energy environments.