REB1

MCU Development Board manufactured with the disruptive HARDSIL® technology offering superior operational lifetimes, leakage and latch-up immunity.

Development Board comprising of PCB and Board Support Package

PCB dimensions – 2.6” x 4.5”
128KB boot SPI EEPROM
3.3V and 1.5V regulators
On-board power distribution and monitoring
On-board clock generation (10MHz – 80MHz)
I2C-based temperature sensor
Power supplied through USB connector
Five LEDs: USB power, J-Link OB active, 3 for GPIO
Connectors with access to 39 GPIO
I2C and SPI PMOD compatible connectors
SPI-based 10-bit ADC
Segger J-Link OB
Part Number Description
REB1-VA10800 Extreme Temperature M0 MCU
REB1-VA10805 Radiation Tolerant M0 MCU
Request Product Brochure
Existing Customers: Please submit a support request for additional assistance.

SUBSCRIBE TO OUR NEWSLETTER FOR THE LATEST UPDATES ON VORAGO TECHNOLOGIES PRODUCTS AND SERVICES.